Dual In-Line Package
<hardware> (DIL, DIP) The most common type of package for small and
medium scale integrated circuits, with up to about 48 pins. The pins hang
vertically from the two long edges of the rectangular package, spaced at
intervals of 0.1 inch. The pins fit through holes in the circuit board to which
they are soldered or into a socket.
[More than 48 pins?]
(1995-02-06)
Nearby terms:
dual-homed « Dual In-Line « Dual In-line Memory
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Dual In-Line Package » dual ported » dual-stack
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