Chip Scale Packaging
<hardware> (CSP) A type of surface mount integrated circuit packaging
that provides pre-speed-sorted, pre-tested and pre-packaged die without
requiring special testing. An example is Motorola's Micro SMT packaging.
See also: chip-on-board, flip chip, multichip module, known good die, ball grid
["Chip scale packaging gains at SMI. (Surface Mount International)", Bernard
Levine, Electronic News (1991), Sept 4, 1995 v41 n2081 p1(2)].
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